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2013 ~
Rapid Development
Year 2023Started the process for establishing Phase ˘ň of Nantong ACCESS (Fab-B); Fab-C have entered the mass production stage.
Year 2021Started the process for establishing Zhuhai YUEXIN (Fab-C)
Year 2018Started the process for establishing Nantong ACCESS (Fab-B); FCBGA have entered the mass production stage in 2021.
Year 2017Embedded Die products have entered the mass production stage.
Year 2014Embedded Die technology was successfully developed.
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2010~2012
Expansion
Year 2011Products officially enter the global supply chain for high-end smartphones.
Year 2010Become one of the first enterprises in the world to realize the mass production of coreless encapsulated cardboard.
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2006 ~ 2009
Start-up
Year 2007Completed the construction of Zhuhai ACCESS (Fab-A).
Year 2006Established ACCESS. Our first substrate was made.