Year 2025Second phase of Nantong ACCESS (Fab-B) has been completed

Year 2023Started the process for establishing Phase Ⅱ of Nantong ACCESS (Fab-B); Fab-C have entered the mass production stage.

Year 2021Started the process for establishing Zhuhai YUEXIN (Fab-C)

Year 2018Started the process for establishing Nantong ACCESS (Fab-B); FCBGA/FCCSP have entered the mass production stage in 2021.

Year 2017Embedded Die products have entered the mass production stage.

Year 2014Embedded Die technology was successfully developed.

Year 2011Products officially enter the global supply chain for high-end smartphones.

Year 2010Become one of the first enterprises in the world to realize the mass production of coreless IC substrates.

Year 2007Completed the construction of Zhuhai ACCESS (Fab-A).

Year 2006Established ACCESS. Our first substrate was made.