Integrated circuit (IC) packaging board (IC Substrate) is the core component of integrated circuit packaging. It is a direct carrier for semiconductor grains (DIE) and various passive devices (Passives). It is also a key material for advanced packaging. The packaging board provides the functions of telecommunications interconnection, performance improvement, fixed support, heat dissipation and isolation protection for semiconductor grains with various passive devices. The function is the basis for realizing the thin, miniaturized, high density and high performance of integrated circuit packaging.
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SiP Package SubstrateSiP (System in Package) refers to the semiconductor module that integrates multiple semiconductor chips and passives in one package to achieve system-level electrical performance. ACCESS¡¯s substrates provide a high-density layout for active and passive devices, to realize the high performance requirements of the customers design with high heat dissipation using proprietary technology that can channel heat thru the substrate and is being used by many of ACCESS¡¯ customers.
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FCBGA Package SubstrateFCBGA (Flip-Chip Ball Grid Array), which is using the high-density micro bumps to connect the digital chips and substrate through the Flip Chip process, and place the passive devices next to the chips on the surface of substrate, to form BGA (Ball Grid Array) or LGA (Land Grid Array) package type. ACCESS uses SAP (Semi-additive process) technology to manufacture the FCBGA substrate with high density and high layer counts to support the high-end flip chips, and make sure the high efficiency electrical interconnect and high-speed transmission.
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Embedded Package Substrate/ModuleA new type of packaging method in which the chip or passive components are embedded between the metal layers inside the substrate, and the I/O of the chip or device are fan-out to the external pin through the micro-vias and metal layers. This chip embedded substrate allows surface area on top to place additional chips and passives devices on the top surface to gain higher integrated level of functionality in 3D stack-up. By using this innovated and customized process, all the components can be integrated in one packaged to form a new system-level package or module.
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