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Key Patents
  • Via-post
    Coreless packaging substrate
    Embedded packaging of active and passive
    Via-post
    Electroplated copper pillar replaces traditional machine drill and laser drill as the interconnection mode between layers of substrate. Electroplated copper pillar or copper block as the vertical channel for heat dissipation of chip. Electroplated copper pillar or copper block as the fabrication method of cavity Electroplated copper pillar or bump as the connector of chip and substrate.
    Method of fabricating a polymer frame with a rectangular array of cavities
    Substrates with ultra fine pitch flip chip bumps
    Multilayer electronic structure with integral stepped stacked structures
    Novel integrated circuit support structures and their fabrication
  • Via-post
    Coreless packaging substrate
    Embedded packaging of active and passive
    Coreless packaging substrate
    No need to use traditional core material Build up process starting from any layer Interconnection between any layers based on copper pillar method Interconnect by arbitrary Shape of solid copper based on copper pillar method. Packaging substrate technology for ultra-thin dielectric layer stacking.
    Method for manufacturing coreless substrate
    Single layer coreless substrate
    Advanced multilayer coreless support structures and method for their fabrication
    Coreless cavity substrates for chip packaging and their fabrication
  • Via-post
    Coreless packaging substrate
    Embedded packaging of active and passive
    Embedded packaging of active and passive
    Reduce the three-dimensional scale of the package. Embedded active and passive components in substrate at the same time, forming system in package Use copper pillar technology to conduct chip I/O and all layers of circuits, with high reliability
    Embedded structure, manufacturing method thereof and substrate
    An integrated circuit packaging method and structure
    Embedded packages
    Chip package
    Method for fabricating embedded chips
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Factory address:
  • Zhuhai Access Semiconductor Co., Ltd.

    Founder PCB Industrial Park, Fushan Industrial Zone, Doumen District, Zhuhai City, Guangdong Province

  • Nantong ACCESS Semiconductor LLC

    No. 349, Fuxi Road, Gangzha District, Nantong City, Jiangsu Province

  • Zhuhai YUEXIN Semiconductor LLC

    No.639 Fushan Second Road, Qianwu Town,Doumen District, Zhuhai City, Guangdong Province

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