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SiP Package Substrate

SiP (System in Package) refers to the semiconductor module that integrates multiple semiconductor chips and passives in one package to achieve system-level electrical performance. ACCESS¡¯s  substrates provide a high-density layout for active and passive devices, to realize the high performance requirements of the customers design with high heat dissipation using proprietary technology that can channel heat thru the substrate and is being used by many of ACCESS¡¯ customers.

Product Features
  • 1.5~12 layers, odd or even layer substrates, ultra-thin substrate stack-up
  • Using via post or copper pillar instead of laser via to realize high-density interconnection of any layer and any shape
  • Via Post or Copper pillar is a sequential build-up substrate plating process which can be started and interconnected at any layer
  • The consistency of copper pillar interconnection can improve the performance of RF package and ensure signal integrity
  • Large Copper block structures can be plated within the substrate to reduce IR drop and improve power integrity
  • Stacked bar-shape copper pillars or plated heat spreaders create a three-dimensional connection channel for efficient heat dissipation for the chip
  • Compatible with traditional Tenting/MSAP technology
Market Application
  • Cellular / Mobile
  • Macro base station
  • Micro Base Station
  • WiFi wireless network
  • AloT Smart Internet of Thing
  • UWB Ultra Wideband
Product Structure

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Other Products
  • FCBGA Package Substrate
  • Embedded Package Substrate/Module
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Factory address:
  • Zhuhai Access Semiconductor Co., Ltd.

    Founder PCB Industrial Park, Toyama Industrial Zone, Qianwan Town, Zhuhai City, Guangdong Province

  • Nantong ACCESS Semiconductor LLC

    No. 349, Fuxi Road, Gangzha District, Nantong City, Jiangsu Province

  • Zhuhai YUEXIN Semiconductor LLC

    Toyama Industrial Zone, Ganwu Town, Doumen District, Zhuhai City, Guangdong Province

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